The surface mount SOIC version of this chip was slightly cheaper, and there’s always a way to make that work (Portuguese, Google Translation). How [Czar] did it is fairly impressive ...

Apple will bring its next-generation M5 chip to the MacBook Pro in the fall, followed by the iPad Pro in the first half of 2026, according ...

While the chip was held down mechanically by the Z-tape, only five of the 48 pins were electrically connected to the pads. Emboldened by the partial success, [Tom] tried a 28-pin SOIC chip next.

TSMC’s process for the M5 will reportedly involve the company’s System on Integrated Chip (SoIC) technology, which enables chip components to be stacked on top of each other in a three-dimensi ...

The M5 processor will adopt a new System on Integrated Chip (SoIC) technology, which enhances thermal management and reduces electrical leakage. With that, we could see enhancements in performance ...

Interestingly, the higher-tier variants are expected to employ TSMC's SoIC-mH (molding horizontal) technology. This 2.5D packaging technique allows for vertical stacking of chips, potentially ...

Apple M5 series processor details: The new Apple M5 series chips will use TSMC's new advanced ... The new M5 Pro, M5 Max and M5 Ultra will use server-grade SoIC packaging, with Apple using 2.5D ...