The two most commonly used types of lead-free solder are SnAgCu (tin-silver-copper, also called SAC) and SnCu (tin-copper). SnAgCu alloy with 3% silver and 0.5% copper (SAC305) was initially ...

SAC series solder paste is a common medium-temperature solder in semiconductor packaging. This type of solder paste can be used for soldering work at relatively high temperatures, and the strength ...

The TLPS soldering-sintering process occurs within seconds of the first reflow. A novel SAC-based TLPS solder paste enables soldering the 2-sided printed circuit boards components that will not ...

This study focused on optimizing Ga-FIB preparation of APT specimens for low-melting SAC305 solder materials. The SAC305 solder alloy specimen was reflowed at 240 °C, then cooled rapidly to 90 ...

This solder paste incorporates the newly designed high- reliability lead-free alloy PF918, which boasts a tensile strength performance 1.4 times greater than the typical SAC305 alloy. Moreover ...