As QLC NAND technology is rapidly penetrating the market, NAND controller chip vendor Phison Electronics expects UFS QLC to ...
Samsung has signed an agreement with China’s YMTC to use its bonding technology in the production of 400-layer NAND flash ...
A class action lawsuit was filed against Micron Technology, Inc. (MU) by Levi & Korsinsky on January 9, 2025. The plaintiffs ...
Wolfe Research reduced Micron Technology's price target to $150 from $175, citing pricing pressures and mix shifts.
South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues to ...
The next generation NAND products include CMOS directly Bonded to Array, CBA, technology; use the recent Toggle DDR6.0 interface standard, separate Command Address protocol, SCA; and Power ...
Leveraging this unique high-speed technology, the companies expect the new 3D flash memory to achieve a 33 percent improvement in NAND interface speed compared with their 8 th generation 3D flash ...
NAND Flash prices reversed downward, with ASP dropping 4% QoQ, while overall bit shipments declined by 2%. Total industry ...
It focuses on 3D NAND flash memory, a critical component in storage devices like SSDs, smartphones, and data centers, and most famously developed Xtacking technology, a proprietary architecture ...
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