AOS launches two new advanced surface-mount package options for its high power MOSFET portfolio, aimed at high-current ...
SemiQ’s 1,200-V third-generation SiC MOSFET, in a smaller footprint, reduces switching losses in high power applications.
The GLPAK with clip technology offers very low package resistance and parasitic inductance, improving EMI performance compared to other package types that employ standard ... Director of MOSFET ...
The GTPAK package, available with the AOGT66909 MOSFET, is a topside cooling package designed to improve heat dissipation. It features a large exposed pad that transfers heat directly to a ...
Infineon is advancing industry-wide standardization by offering its CoolGaN Generation 3 (G3) transistors in silicon MOSFET packages. The IGD015S10S1 100-V transistor will be housed in a 5×6-mm ...
Combining AOS-proven robust MOSFET technology with advanced packaging ... improving EMI performance compared to other package types that employ standard wire bonding. The GTPAK and GLPAK packages ...