South Korean researchers have developed a process to produce ultra-thin wafers without sacrificing any of the substrates. Their technique is based on a new approach involving the use of plasma ...

It also claims that its technology can enable the production of ultra-thin wafers. It has already demonstrated this on its pilot line in Freiburg, Germany. NexWafe develops and produces ...

These changes have led to a number of metrology challenges, including: Common spectroscopic ellipsometry doesn’t meet long term stability of gate oxide measurement. Single wavelength ellipsometry (SWE ...

The demand for ultra-thin wafer dicing to facilitate higher memory ... The Light-emitting Diode (LED) segment is anticipated to register the fastest growth from 2024 to 2032.

Led by a team from the Okinawa Institute of Science and Technology (OIST) in Japan, a team of researchers have found a way to ...