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Intel has processed 30,000 wafers with High-NA EUV chipmaking toolIntel has started using two leading-edge ASML High-NA Twinscan EXE:5000 EUV lithography tools, the company revealed on Monday at an industry conference, Reuters reports. The company uses these ...
Extreme ultraviolet (EUV) lithography is at the center of next-generation semiconductor manufacturing as it enables smaller ...
Huawei, SMIC reportedly advancing LDP lithography, eye 3Q25 trial, 2026 rollout China is making significant strides in ...
Intel's vertically integrated business model and substantial investments in R&D position it for long-term growth. Learn why ...
A major breakthrough at Peking University might have just found the first step beyond silicon for semiconductors.
CEO, has joined venture capital firm Playground Global as a general partner, marking a major move in the semiconductor and ...
Discover why ASML dominates the lithography market with 90% DUV share, strong R&D, and robust growth prospects amid ...
Additionally, Intel has a lead in the newest imaging technology (high NA EUV lithography, where they are currently processing 10,000s wafers) and in backside power delivery to complex chips.
Pat Gelsinger, the former CEO of Intel, has joined Silicon Valley venture capital firm Playground Global as a general partner ...
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