[Martin Thuo] at Iowa University used this property to make solder joints at room temperature using Field’s metal (a combination of bismuth, indium ... s metal will melt again at 62 degrees ...
CLINTON, NY – Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan. The presentation, High Reliability ...
PF925-P250 No-Clean Zero-Halogen Lead-Free Solder Paste. Developed to fulfil the needs of high-reliability applications, paste delivers outstanding performance and enhanced durability. The paste was ...