Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board is thrown through a reflow oven, and hopefully at the end, everything works. Sometimes these ...

The wafer-level isn’t that unorthodox as far as manufacturing goes. It’s something like chip on board electronics which have that black blob of epoxy sealing them after the connections are made.

LG Innotek has begun mass production of its flip chip ball grid array semiconductor substrate for U.S. clients.

Kontron has announced the BGA-version of its embedded Mini-ITX motherboard KT690/mITX (BGA) with an increased level of robustness and improved cost-performance ratio. Customers benefit from ...